Comparison of matrix extrusion under normal conditions and with the use of IES in automatic mode.
In Manual mode, without active controls, billet 6 is very hot upon exiting the kiln.
The high temperature enables faster extrusion, quality is penalised however. The effect of the high peak in temperature is visible on the profile and generates waste.
In Automatic mode, with IES activated, the kiln sends billet 14 with a higher than normal temperature; IES reacts by immediately slowing down extrusion and maintaining extruded profile temperature close to set temperature, thus protecting profile quality.
At the end of comparative tests, IES in automatic mode reduces extrusion time by 17%, maintaining the requested high quality standard, minimising waste and actively reacting to particular plant imbalances
AUTOMATIC CONTROL OF BILLET TEMPERATURE
Offset for temperature in end area of Billet Kiln. Two corrections are available for kilns with conical firing (for either end).
AUTOMATIC CONTROL OF DYNAMIC EXTRUSION SPEED
Offset calculated for speed to maintain optimal temperature upon exiting the press and continuous application during press operation.
AUTOMATIC CONTROL STEP SPEED (BILLET PER BILLET)
Calculated optimal offset is applied to initial press speed with use of
billet with same matrix code.
In manual mode, the press works with the same controls of the same day, whereas in automatic mode, IES applies continuous adjustments.
The operator can choose the type of extrusion management any time in order to optimally exploit press potential.
The end result translates into improved energy management with considerable savings, increased production speed and therefore enhanced productivity along with notably superior quality of extruded material.
Where present, this is where the cooling of matrices with liquid nitrogen is managed.
The management of orders and isothermal extrusion culminate in IES PLUS. Founded on a single SQL database, IES PLUS keeps a record of all production data, matrices and associated orders. Production programming, matrix recipes and order traceability are what distinguishes it from the standard version of IES.
IES means Isothermal Extrusion SAI; TPC means ‘Temperature Process Control’
The IES/TPC is a system of sensors and software that controls the ram speed and billet temperature in order to maintain a constant exit temperature. Like a cruise control in a car stabilizing the speed the IES/TPC is a cruise control for the press stabilizing the exit temperature.
Reliable product quality prerequisites keeping the exit temperature constant. Mechanical properties are not guaranteed if the profile is too cold. Surface defects can appear if the profile is too hot.
The IES/TPC continuously gets information from the press about current exit temperature and press pressure. It calculates the time it takes the pressure to decrease from break through pressure by 4bar.
The right target temperature is currently unknown. In any case it is depending on the product. It should always be between 540°C and 580°C. Below 540°C the mech. properties are not guaranteed, above 580°C the risk of getting surface defects is very high. Start with an average temperature and observe the surface quality. The hottest spot may be located inside or underneath the profile, therefore inaccessible for the temperature measurement.If the temperature acquired at the 4th billet is obviously too low or too high, change it manually to a reasonable value.
No. The IES/TPC stores the actual target temperature of the last order for each die and it retrieves this value at the start of a new order. But with the 3rd billet in this new order, the IES/TPC acquires the actual temperature and overwrites the value loaded from the database.
You as the press driver can determine by how much the IES/TPC may change ram speed and billet temperature. That is what the offsets are for.
The offset 5+5 at the speed control are displayed as percent yielding +-10%.
The offset 10+30 at the billet temperature are displayed in °C yielding +-10°C for the head and +-30°C for the foot temperature.
At the dynamic speed control the IES/TPC changes the speed during the push of a billet over the base speed. At the step speed control the IES/TPC changes the speed from billet to billet. With the dyn. speed control the TPC compensates thermal differences. With the step speed the IES/TPC gains speed generally.
No. The dyn. speed control should not be below 5% in order to grant the IES/TPC the right to balance out temperatures. The step control determines how far away from the base speed the IES/TPC may change the speed. Here, a zero can be right in case a speed limit shall be in place. Also, 20% can be right in case there is no speed limit in sight.
If the exit temperature for whatever reason is much too high the IES/TPC must be allow to run slower in order to drop the exit temperature and prevent tearing or other surface defects. If you limit the dyn. offset to 2% the IES/TPC will not be able to slow down in case of an emergency. The IES/TPC will only extruded slower if the exit temperature if hotter than the target temperature. Therefore, you should always pay attention to a correct setting of the target temperature.
If the downtime appeared during
You have to check the quench exit temperature yourself and verify that this temperature and quench rate is appropriate for the profile. If the IES/TPC runs faster the quench rate decreases. You will have to adapt the quench setting or limit the extrusion speed if need be.
The IES/TPC can be equipped with additional thermal cameras to detect quench exit temperatures and to calculate quench rates. In this case the IES/TPC will then determine automatically whether an increase in speed is feasible.
It is always possible that setting a speed limit is necessary. In order to do so
The IES/TPC will now increase ram speed by 5% over the base speed yielding 10mm/s. At the same time, the IES/TPC is allowed to decrease by 5% from the base speed if need be.
Important note: If introducing the speed limit is caused by the die, please provide the die shop with a sample of good and poor quality labeled with the individual speed, product and die information and ask die shop to correct the die accordingly to that higher speed.
At a total crash (e.g. IES/TPC -PC is down, software closed …) the IES/TPC automatically turns off and the press behaves just if there had never been a IES/TPC that means all inputs are regularly processed at the press panel.
No software is free from malfunction. Yet sometimes it might look like a malfunction but is in fact simply doing what it was told. It is your task as the press driver to ensure proper function of the IES/TPC by checking whether
Right now the IES/TPC is not programmed in a way to specifically support multi billet extrusion. The IES/TPC will observe that break through time and pressure vary from billet to billet. As the IES/TPC´s reaction is averaging out the behaviour of several subsequent billets (moving average) it will tend to set step speed and billet temperature to an average value.
The dyn. speed control will react in any case. The short billet will presumably be a little bit too hot therefore slowed down over what would be achievable if the short billet was as cold as it should be. The long one will be a little bit too cold and therefore start slow. Multi billet extrusion is possible with the IES/TPC; however it might be reasonable to keep the billet temperature uncontrolled to be ideal for the long billet.
Currently, the IES/TPC does not know about a pending die change therefore it keeps controlling the billet temperature. Once you called the last billet of an order, you have to disable the billet temperature control at the IES/TPC. After the 3rd billet of the next order, the IES/TPC will automatically switch itself on again. It is planned to modify the IES/TPC so it knows about the pending die change itself and switches off the billet temperature control.
For the IES/TPC a two-push-billet is just like a downtime during the push of a billet. The IES/TPC will react all normal.
During the current order, the IES/TPC reduces the billet temperature by 20°C which is fine. Within the next few billets, the die will be changed. Now the IES/TPC keeps decreasing the billet temperature, therefore the first billet of the new die will also be reduced. How can I prevent that?” => “Currently, the IES/TPC does not know about a pending die change therefore it keeps controlling the billet temperature. Once you called the last billet of an order, you have to disable the billet temperature control at the IES/TPC. After the 3rd billet of the next order, the IES/TPC will automatically switch itself on again. It is planned to modify the IES/TPC so it knows about the pending die change itself and switches off the billet temperature control.
As soon as you change the alignment of the camera, the temperature read will change and still the IES/TPC will control the press using the measurement – following the virtual change of temperature by changing the ram speed. In order to prevent this, you have to disable both speed controls and enable them when finished with aligning the camera.
NEW RELEASE: At the end of the manual alignment, automatically the IES/TPC will do an autocapture and set the new target temperature.
The IES/TPC will only change speed and billet temperature around the set values within the range you permitted to it. If you observe that the IES/TPC uses one of the offset limits to the full extent, you should check to
Any hot object radiates energy – the hotter the more (intensity), depending on the material more or less (emissivity). Aluminium itself radiates only a little amount of its energy (that is why you don´t feel the warmth being close to hot aluminium with your bare hand – unlike steel). The thermal camera measures the intensity and emissivity of the object it is directed to so it can detect whether the object is made of aluminium (the emissivity matches the valid range for aluminium).
As long as the camera does not read any plausible temperature and emissivity, the control stays deactivated even if the buttons are green. If the camera does not read any signal for a longer period of time, it restarts panning – but only if auto-aiming is active.
The IES/TPC detect that the signal was lost during a downtime. In this case it will not initiate a new scan but stay where it is and also keep all settings.
At the IES/TPC: not at all. This would not make sense as the reaction time of the IES/TPC is much too long to control press pressures. So limiting the IES/TPC in terms of pressure would not guarantee not having that pressure. Therefore, the pressure must be limited directly at the press panel. The IES/TPC will then react accordingly by setting billet temp. and speed.
The IES/TPC does not (and does not need to) detect any order change. If the billet length changes with the order change the IES/TPC will notice a change in break through time and pressure and adapt to it.
Download our presentations